China’s leading memory chipmaker ChangXin Memory Technologies (CXMT) will supply its latest LPDDR6 DRAM for Xiaomi’s upcoming flagship foldable smartphone, marking a significant breakthrough for China’s semiconductor industry, according to Reuters and Korea Herald. The device, expected to launch as the Xiaomi 18 Fold in September, will pair CXMT memory with Xiaomi’s new in house 3 nanometre Xring O3 processor.
The deal highlights CXMT’s rapid progress in advanced memory technology. The company only began mass producing the previous generation LPDDR5 less than a year ago and has now moved into LPDDR6 production, narrowing the technology gap with global leaders such as Samsung and SK Hynix.
For Xiaomi, the partnership strengthens its strategy of developing more of its core smartphone technology domestically. The Xring O3 is manufactured by TSMC using a 3 nanometre process and is expected to power the new foldable, while Xiaomi continues to invest heavily in its own semiconductor capabilities.
The development is also significant amid a global memory shortage driven partly by surging AI and data centre demand. CXMT reported a sharp turnaround in the first half of 2026, with revenue rising 874% year on year to 150.3 billion yuan, underscoring the growing commercial importance of China’s memory chip industry.
